Glass Substrates: The Final Frontier of Semiconductor Packaging
The shift toward Glass Substrates represents the most significant breakthrough in semiconductor packaging since the 1970s. As the world transitions into the era of trillion-transistor AI chips, our traditional foundations—organic plastic resins—are physically failing to support the weight of modern computing. The “Silicon Ceiling” For decades, we have used Organic Substrates (specifically Ajinomoto Build-up Film, or ABF) as the […]
